Molding Process 3 visualizações

POE film puncture strength low

Fenómeno do problema

POE film puncture <10N, below 15N

Análise das causas

POE elastic modulus low, large deformation under puncture; thickness <0.05mm

Solução

1) Thicken to 0.08-0.1mm; 2) 5-10wt% HDPE to increase modulus; 3) DCP 0.2wt% slight crosslinking

Conclusão principal

Low puncture is caused by low modulus and thin thickness; thickening and stiffening

POE filmpuncture strengthelastic modulusfilm thicknessslight crosslinking

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