Molding Process
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POE film puncture strength low
Problem Phenomenon
POE film puncture <10N, below 15N
Cause Analysis
POE elastic modulus low, large deformation under puncture; thickness <0.05mm
Solution
1) Thicken to 0.08-0.1mm; 2) 5-10wt% HDPE to increase modulus; 3) DCP 0.2wt% slight crosslinking
Key Takeaway
Low puncture is caused by low modulus and thin thickness; thickening and stiffening
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