Material Analysis
10 Aufrufe
Analysis and solution of bubble of High-temp MB in PA electronic parts
Problembeschreibung
High-temp MB shows abnormal performance related to bubble when producing electronic parts with PA.
Ursachenanalyse
The main cause is parameters not strictly controlled in terms of bubble leading to unstable processing.
Lösung
Comprehensively solve the bubble problem from the perspective of equipment improvement.
Wichtigste Erkenntnis
Control of bubble of High-temp MB is the key link to ensure processing quality.
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