Material Analysis
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Analysis and solution of bubble of High-temp MB in PA electronic parts
Fenómeno del problema
High-temp MB shows abnormal performance related to bubble when producing electronic parts with PA.
Análisis de la causa
The main cause is parameters not strictly controlled in terms of bubble leading to unstable processing.
Solución
Comprehensively solve the bubble problem from the perspective of equipment improvement.
Conclusión clave
Control of bubble of High-temp MB is the key link to ensure processing quality.
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