Material Analysis
11 조회수
Analysis and solution of bubble of High-temp MB in PA electronic parts
문제 현상
High-temp MB shows abnormal performance related to bubble when producing electronic parts with PA.
원인 분석
The main cause is parameters not strictly controlled in terms of bubble leading to unstable processing.
해결 방법
Comprehensively solve the bubble problem from the perspective of equipment improvement.
핵심 요약
Control of bubble of High-temp MB is the key link to ensure processing quality.
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