Material Analysis
9 views
Analysis and solution of bubble of High-temp MB in PA electronic parts
Problem Phenomenon
High-temp MB shows abnormal performance related to bubble when producing electronic parts with PA.
Cause Analysis
The main cause is parameters not strictly controlled in terms of bubble leading to unstable processing.
Solution
Comprehensively solve the bubble problem from the perspective of equipment improvement.
Key Takeaway
Control of bubble of High-temp MB is the key link to ensure processing quality.
Was this helpful?
0 people found this helpful
Thank you for your feedback!