Material Analysis
13 مشاهدة
Analysis and solution of bubble of High-temp MB in PA electronic parts
ظاهرة المشكلة
High-temp MB shows abnormal performance related to bubble when producing electronic parts with PA.
تحليل الأسباب
The main cause is parameters not strictly controlled in terms of bubble leading to unstable processing.
الحل
Comprehensively solve the bubble problem from the perspective of equipment improvement.
الخلاصة الأساسية
Control of bubble of High-temp MB is the key link to ensure processing quality.
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