Extrusion & Post
10 조회수
Analysis and Solution of mold temperature of PAK in coating of electronic components
문제 현상
When producing electronic components by coating, PAK shows abnormal performance related to mold temperature.
원인 분석
The main reason is that parameters deviate from the window in the aspect of mold temperature, leading to unstable processing.
해결 방법
Comprehensively solve the mold temperature problem from the perspective of raw material control.
핵심 요약
The mold temperature control of PAK is the key link to ensure processing quality.
이 정보가 도움이 되었나요?
0 명이 도움이 되었다고 합니다
의견 주셔서 감사합니다!