Extrusion & Post
12 مشاهدة
Analysis and Solution of mold temperature of PAK in coating of electronic components
ظاهرة المشكلة
When producing electronic components by coating, PAK shows abnormal performance related to mold temperature.
تحليل الأسباب
The main reason is that parameters deviate from the window in the aspect of mold temperature, leading to unstable processing.
الحل
Comprehensively solve the mold temperature problem from the perspective of raw material control.
الخلاصة الأساسية
The mold temperature control of PAK is the key link to ensure processing quality.
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