Extrusion & Post
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Analysis and Solution of mold temperature of PAK in coating of electronic components
Problembeschreibung
When producing electronic components by coating, PAK shows abnormal performance related to mold temperature.
Ursachenanalyse
The main reason is that parameters deviate from the window in the aspect of mold temperature, leading to unstable processing.
Lösung
Comprehensively solve the mold temperature problem from the perspective of raw material control.
Wichtigste Erkenntnis
The mold temperature control of PAK is the key link to ensure processing quality.
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