Extrusion & Post
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Analysis and Solution of mold temperature of PAK in coating of electronic components
Problem Phenomenon
When producing electronic components by coating, PAK shows abnormal performance related to mold temperature.
Cause Analysis
The main reason is that parameters deviate from the window in the aspect of mold temperature, leading to unstable processing.
Solution
Comprehensively solve the mold temperature problem from the perspective of raw material control.
Key Takeaway
The mold temperature control of PAK is the key link to ensure processing quality.
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