Extrusion & Post
11 görüntüleme
Analysis and Solution of mold temperature of PAK in coating of electronic components
Sorun Belirtisi
When producing electronic components by coating, PAK shows abnormal performance related to mold temperature.
Neden Analizi
The main reason is that parameters deviate from the window in the aspect of mold temperature, leading to unstable processing.
Çözüm
Comprehensively solve the mold temperature problem from the perspective of raw material control.
Temel Çıkarım
The mold temperature control of PAK is the key link to ensure processing quality.
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