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문제 및 해결책

일반적인 플라스틱 재료 문제에 대한 실질적인 답변

11636 질문
Q
CEF internal stress concentration severe
A
Internal stress is caused by fast injection and uneven cooling; reducing speed, uniform cooling and annealing are the key
Injection Molding CEFinternal stressorientation stressannealing treatmentuniform cooling
Q
CEF surface dense pockmarks
A
Pockmarks are caused by raw material impurities and mold damage; pure raw materials and mold maintenance are the key
Extrusion & Post CEFsurface pockmarkimpurity particlesmold repairraw material purity
Q
CEF flame retardant effect not up to standard
Q
CEF stress cracking
A
Stress cracking is caused by stress-accelerated chemical attack; annealing and high MW are the key
Production & Quality CEFstress crackingenvironmental stressannealing treatmenthigh molecular weight
Q
CEF surface micro-cracks
A
Micro-cracks are caused by excessive internal stress; annealing and crack-resistant design are the key
Production & Quality CEFmicro-crackinternal stressannealing treatmentstress concentration design
Q
CEF surface gloss poor
Q
CEF machine cleaning difficult
A
Difficult machine cleaning is caused by the strong adhesion of CEF; PE flushing and temperature reduction are the key
Processing Machinery CEFmachine cleaning difficultadhesionPE flushingspecial cleaning material
Q
CEF material changeover residue
A
Material changeover residue is caused by incomplete cleaning; sufficient cleaning and disassembly are the key
Processing Machinery CEFmaterial changeover residuecleaning materialscrew disassemblydead corner cleaning
Q
CEF UV aging fast
A
Fast UV aging is caused by photo-oxidation; UV absorber and HALS are the key
Material Analysis CEFUV agingUV absorberHALSfree radical capture
Q
CEF shrinkage rate unstable
A
Unstable shrinkage rate is caused by batch differences and temperature fluctuations; raw materials and temperature control are the key
Material Analysis CEFshrinkage ratebatch differencetemperature control stabilitycrystallization consistency
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